VTHWN 2017

International Workshop on Vehicular Telematics over Heterogeneous Wireless Networks 

in conjunction with CollaborateCom 2017  Dec. 11-12, 2017, Edinburgh, Great Britain


Vehicular Telematics are gaining significant interest from academic and industry. Following the successful deployment of many wireless access technologies as well as their corresponding infrastructures, the next significant evolution to the practical realization of highly efficient vehicular telematics is the vehicular telematics over heterogeneous wireless networks, which uses multiple access technologies and multiple radios in a cooperative manner. Multiple wireless communication and networking technologies including WiFi, WiMax, DSRC, 3G, Zigbee, Bluetooth, LTE as well as satellite technology are vital to support reliable data transmission for vehicular telematics and other relevant applications. However, each of them stands alone, operates independently on different frequency bands and has its own historic justification; one single type of those wireless networks is far more insufficient to address all types of safety, traffic and comfort applications over all situations, and neither purely infrastructure-based nor purely ad-hoc vehicular networks can meet all the requirements of vehicular telematics at the same time. It is obvious that integrating those existing heterogeneous wireless networks will constitute a much more powerful unified architecture able to fully exploit capability and radio resources of all the individual wireless networks, to provide a framework for various applications of vehicular telematics and to enable users to enjoy “ABC (Always Best Connection) anywhere at any time.
The goal of this workshop is to present and discuss the recent advances in vehicular telematics over heterogeneous wireless networks. The topics in this workshop will cover those emerging researches that aim at dealing with the challenges in designing the essential functional components of vehicular telematics over heterogeneous wireless networks and the corresponding protocols (for radio link control, routing, congestion control, security and privacy, and application development). Additionally, the workshop will also put a deep insight into the cooperation of multiple radios and multiple access technologies for the integration of heterogeneous wireless networks, and focus on the issues that are related to multi-mode communications, the ubiquitous connection through converged vehicular networks, heterogeneous resources management as well as the development of various advanced information applications in telematics and infotainment systems.

Topics of Interest

Areas of interest include, but are not limited to:

  • Novel Architecture and Integration Mechanisms for Vehicular Heterogeneous Networks
  •  Multi-mode Communication Solutions for Coexistence of Cellular, Broadcasting, and WLAN Technologies, Involving Resources Management, Handover Management, QoS Provisioning, and Interworking Aspects
  • Security & Privacy Issues in Vehicular Heterogeneous Wireless Environment
  • Routings & Protocols for Integration of Heterogeneous Wireless Systems
  • Heterogeneous Telematics Applications for Mobile Multimedia Networks and Mobile Internet Things
  • Prototype & Field Tests for Multi-mode Communication Technologies or Integrated Heterogeneous Wireless Systems


Papers should be submitted through EAI ‘Confy’ system at Confy, and have to comply with the SPRINGER format (see Author’s kit section).


See https://collaboratecom.eai-conferences.org/2017/2017/show/initial-submission

Important Dates

Paper submission due: September 15, 2017


Daxin Tian, Beihang University, China
Email:[email protected]

Technical Program Committee

Jian Wang, INRIA, France
Wei Shangguan, Beijing Jiaotong University, China
Xinkai Wu, Cal Poly Pomona, US
Dayang Sun, the University of British Columbia, Canada
Shangguang Wang, Beijing University of Posts and Telecommunications, China
Xiaolei Ma, University of Washington, US
Jianqiang Wang, Tsinghua University, China
Guangquan Xu, Tianjin University, China
Haoming Li, Freescale Semiconductors, Inc., US
Zheli Liu, Nankai University, China
Man Hon Cheung, The Chinese University of Hong Kong, China